Montreal, Canada, January 31, 2008 – Metafoam Technologies Inc. is proud to announce that its latest generation of boiling surfaces is reaching new heights. Latest test results reveal that Metafoam's boiling surfaces, based on its metal foam technological platform, can handle heat fluxes up to 76 watts per square centimeter, meaning close to 500 watts for a standard processor die.
"This new generation of pool boiling surfaces allows Metafoam to consolidate its position in the electronic thermal management market", according to Dominic Pilon, Metafoam's Founder and Chief Technology Officer.
About Metafoam
Metafoam Technologies is specialized in the development, production and commercialization of open-cell copper foams. Through its patented technologies, Metafoam is revolutionizing the open-cell copper foams industry by offering the highest specific surface area. Thanks to this industry-leading performance, Metafoam is focusing on wick structures for the electronic thermal management market.
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Phone: +1 (450) 444 5678
info@metafoam.com
Latest Generation of Metafoam's Boiling Surfaces Can Manage Heat Loads Close to 500 Watts
Posted on Thursday January 31, 2008
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