Open-Cell Copper Foam
There are two distinct types of metal foams: open-cell and closed-cell structures. The key difference between the two structures is that open-cell foams are permeable and will allow fluids to pass through the foam whereas closed-cell foams are impermeable.
Metafoam’s open-cell copper foam technology is built on a lace microstructure which improves properties found in standard metal foams. It represents a new lightweight / high performance wick platform that solves some of the most critical thermal management challenges in the electronics sector. Metafoam’s copper foams are particularly fitted to replace the current copper powder-based wick structures used industry-wide in heat pipes and vapor chambers.
Metafoam’s open-cell copper foam technology is built on a lace microstructure which improves properties found in standard metal foams. It represents a new lightweight / high performance wick platform that solves some of the most critical thermal management challenges in the electronics sector. Metafoam’s copper foams are particularly fitted to replace the current copper powder-based wick structures used industry-wide in heat pipes and vapor chambers.
Metafoam produces an innovative open-cell metal foam microstructure which is composed of pores interconnected by windows in a lace microstructure
Metafoam produces an innovative open-cell metal foam microstructure which is composed of pores interconnected by windows in a lace microstructure
One of the key differences of Metafoam’s microstructure is that the lace microstructure provides a greater surface area than the one found in sintered copper powder. The lace microstructure also has a significant impact on the flow of liquid through the foam (increased permeability). The distinctive microstructure of Metafoam’s metallic foams has up to 100 times more specific surface area than competing manufacturers’ foams. This particular microstructure also permits capillarity properties that are unmatched in the market. Capillarity is crucial in numerous wicking applications like heat pipes and vapor chambers used in the electronic cooling industry.